Shenzhen Yizhuo Electronics Co., Ltd
Shenzhen Yizhuo Electronics Co.,Ltd has been established in 2012 years, Our factory area more than 5,000 square meters. We have more than 100 workers and 20 employees.We are Aluminum PCB and FR4 PCB
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Aluminum Base PCB Gold Plated 2oz Copper Printed Circuit Board
PCB PRODUCTION CAPACITY
| PCB layers | 1-layer to 10-layer(including HDI board) |
| Finish type | Gold-plated,Immersion gold-plated, HAL finish , Flux., Carbon -bridge, Entek, Nickel plating |
| Base material | FR4,CEM-1,CEM-3,FR1,FR2, Aluminium metal substrate and Rogers |
| Base material thickness | 0.4-2.4mm. |
| Copper foil thickness | 18um(H/HOZ) ,35um(1/1OZ) ,70um(2/2OZ), 5OZ |
| Maximum-product board | 500*700mm. For AL PCB: 500*1400mm |
| Minimum drilled hole size | 0.075mm |
| Minimum track width/spacing | 3mil |
| Average hole wall copper | Thickness for HAL board: ≥25um.Gold-finger plating: ≥0.1um |
| Solder mask ink | Photo cure ink, heat cure ink. UV ink |
| Outline tolerance | ±0.1mm |
| Hole diameter tolerance/ Hole location tolerance | ±0.076mm/±0.076mm |
| V-CUT tolerance | ±0.1mm. |
| Warp | According to the IPC-600F standard |
| lead time | Single-sided: 2-3 working days; Double-sided: 3-4 working days; Multi-layer: 8-10 working days |
PCBA MANUFACTURING CAPABILITY
| PCB assembly Layers | 1 Layer to 36 layers (standard), |
| PCB assembly material/type | FR4, Aluminum, CEM1, Super-thin PCB, FPC/Gold finger |
| PCB Assembly service type | DIP/SMT or Mixed SMT & DIP |
| Copper thickness | 0.5um-4um |
| Assembly surface finish | HASL,ENIG,OSP |
| PCB Dimension | 600x1200mm |
| IC Pitch(min) | 0.2mm |
| Chip Size(min) | 01005 |
| Leg distance(min) | 0.3mm |
| PCB BGA Size | 8x6mm~55x55mm |
| IC Encapsulation type | SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA |
| u-BGA ball dia. | 0.2mm |
| Required Docs for PCBA | Gerber file with BOM list & Pick-N-Place File(XYRS) |
| SMT speed | CHIP components SMT speed 0.3S/pcs, max speed 0.16S/pcs |