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LED PCB Board Assembly
Layer		Single-side, Double Side,Multilayer
Board thickness		0.8, 1.0, 1.2, 1.5, 1.6, 2.0
Technical Specification		Minimum line width/gap:3.5/4mll(laserdrill) Minimum hole size:0.2mm(mechanical drill)/4mil(laser drill) Minimum Annular Ring: 4mil Max Copper thickness: 60Z Board Thickness:D/S: 0.2-4.0mm. Multilayers:0.40-4.0mm, Min Solder Mask Bridge:0.08mm Aspect ratio: 8: 1 Plugging Vias capability: 0.2-0.8mm
Surface Treatment		OSP

LAYER	PROTOTYPE		MASS PRODUCTION (above 20 m2)
	PROTOTYPE			Quick Turn	Standard Time
	MC PCB	48 hours		4-5 days	10-12 days
PFC 1 L	48 hours	5-6 days	12-13 days
1L	24 hours	3-4 days	8-10 days
2L	24 hours	3-4 days	8-10 days
4L	48 hours	5-6 days	8-10 days
6L	72 hours	6-7 days	10-12 days
8L	72 hours	7-8 days	12-14 days
10L	96 hours	9-10days	16-18 days

Board Thickness 0.8mm 2.0mm Heavy Copper PCB Customized Multilayers

LED PCB Board

LED Light PCB

Aluminum LED PCB

LED MCPCB

Custom LED PCB

LED Printed Circuit Board

LED Quantum Board

FR4 PCB

Prototype PCB Assembly

Heavy Copper PCB

Double Sided PCB

Single Sided PCBs

Board Thickness 0.8mm 2.0mm Heavy Copper PCB Customized Multilayers

0.6 mm thickness multilayer pcbs

1.6mm thick multilayer pcbs

standard pcb thickness